Seongnam-si, South Korea

Kun Mo Chu

USPTO Granted Patents = 3 

Average Co-Inventor Count = 6.3

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Seongnam-si, KR (2015 - 2016)
  • Yongin-si, KR (2016)

Company Filing History:


Years Active: 2015-2016

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3 patents (USPTO):Explore Patents

Title: Innovator Kun Mo Chu: Pioneering Advances in Heat Dissipation and Heating Technologies

Introduction

Kun Mo Chu is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the fields of heat dissipation materials and heating technologies. With a total of 3 patents to his name, his work continues to influence advancements in electronic components and heating systems.

Latest Patents

Among his latest patents, Kun Mo Chu has developed a heat dissipation material and a light-emitting diode package that incorporates this innovative material. The heat dissipation material comprises a metallic glass and an organic vehicle, enhancing the efficiency of electronic devices. Additionally, he has created a heating composite that includes a polymer matrix and a carbon nanotube structure, which integrates seamlessly with the polymer matrix to improve heating performance.

Career Highlights

Kun Mo Chu is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in materials science and engineering. His work at Samsung has positioned him as a key player in the development of advanced electronic components that require efficient thermal management.

Collaborations

Throughout his career, Kun Mo Chu has collaborated with talented individuals such as Eun Sung Lee and Sang Soo Jee. These partnerships have fostered innovation and have contributed to the successful development of his patented technologies.

Conclusion

In summary, Kun Mo Chu is a distinguished inventor whose work in heat dissipation and heating technologies has made a significant impact in the electronics industry. His innovative patents and collaborations continue to pave the way for future advancements in these critical areas.

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