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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9516739 B1

PDFFull Text
Expired
Date of Patent:
Dec. 06, 2016

Filed:

Nov. 19, 2014

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Applicants:

Eun Sung Lee, Seoul, KR;

Sang Soo Jee, Hwaseong-si, KR;

Kun MO Chu, Seongnam-si, KR;

SE Yun Kim, Seoul, KR;

Kyu Hyoung Lee, Yongin-si, KR;

Sang Mock Lee, Yongin-si, KR;

Inventors:

Eun Sung Lee, Seoul, KR;

Sang Soo Jee, Hwaseong-si, KR;

Kun Mo Chu, Seongnam-si, KR;

Se Yun Kim, Seoul, KR;

Kyu Hyoung Lee, Yongin-si, KR;

Sang Mock Lee, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Selim Ahmed

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H05K 1/02 (2006.01); B23K 35/26 (2006.01); C22C 45/00 (2006.01); H01L 33/64 (2010.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); B23K 35/26 (2013.01); C22C 45/00 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12044 (2013.01); H05K 3/0061 (2013.01); H05K 3/32 (2013.01); H05K 3/3463 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.

Find Patent Forward Citations

Lee, Eun. (2016). Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material (U.S. Patent No. 9516739). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9516739

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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