The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Aug. 19, 2011
Applicants:
Eun Sung Lee, Seoul, KR;
Sang Soo Jee, Hwaseong-si, KR;
Kun MO Chu, Seongnam-si, KR;
SE Yun Kim, Seoul, KR;
Kyu Hyoung Lee, Yongin-si, KR;
Sang Mock Lee, Yongin-si, KR;
Inventors:
Eun Sung Lee, Seoul, KR;
Sang Soo Jee, Hwaseong-si, KR;
Kun Mo Chu, Seongnam-si, KR;
Se Yun Kim, Seoul, KR;
Kyu Hyoung Lee, Yongin-si, KR;
Sang Mock Lee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H05K 1/02 (2006.01); B23K 35/26 (2006.01); C22C 45/00 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); B23K 35/26 (2013.01); C22C 45/00 (2013.01); H05K 3/0061 (2013.01); H05K 3/32 (2013.01); H05K 3/3463 (2013.01); H05K 2201/10106 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01);
Abstract
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.