Shenzhen, China

Kun Liu

Average Co-Inventor Count = 4.0

ph-index = 12

Forward Citations = 507(Granted Patents)

Forward Citations (Not Self Cited) = 420(Sep 21, 2024)

DiyaCoin DiyaCoin 0.96 

Inventors with similar research interests:


Location History:

  • Jiangsu, CN (2017 - 2018)
  • Nanjing, CN (2017 - 2021)
  • Shenzhen, CN (2009 - 2024)
  • Guangdong, CN (2018 - 2024)
  • Dongguan, CN (2021 - 2024)


Years Active: 2009-2025

where 'Filed Patents' based on already Granted Patents

184 patents (USPTO):

Title: Kun Liu: A Prolific Innovator in Shenzhen

Introduction:

Kun Liu, a highly skilled inventor and engineer based in Shenzhen, China, has made significant contributions to the field of telecommunications and engineering design. With an impressive track record of 158 patents, Liu's innovative ideas have propelled him to the forefront of technological advancements in information transmission methods and backplane connector design. This article explores some of Kun Liu's latest patents, highlights his career achievements, and sheds light on his collaborations with notable companies and coworkers.

Latest Patents:

Among Kun Liu's recent patents, two stand out as prominent examples of his expertise in the telecommunications industry:

1. Information Transmission Method, and Base Station, Terminal, and Computer-Readable Storage Medium:

Liu's information transmission method patent introduces a novel approach that enhances the efficiency of communication networks. The method involves a base station sending a first message, comprising channel quality threshold values or a deviation value relative to those threshold values. These threshold values are determined based on various factors, such as reference signal receiving power, signal quality, and path losses. This method brings significant improvements to information transmission and reception within communication networks.

2. Backplane Connector with Improved Mounting Block:

In another patent, Kun Liu addresses the design challenges of backplane connectors. This innovation features a housing, multiple terminal modules, and an electroplated plastic mounting block. The backplane connector's housing includes a receiving groove for the mounting block, ensuring proper installation. The use of electroplated plastic material in the mounting block enhances the connector's shielding capabilities, leading to better signal integrity and overall performance.

Career Highlights:

Kun Liu's career encompasses valuable experiences in renowned companies within the telecommunications and pharmaceutical sectors. Some of his career highlights include:

1. ZTE Corporation:

During his tenure at ZTE Corporation, a global leader in telecommunications solutions and services, Liu made notable contributions to the company's research and development efforts. His expertise in information transmission methods and integration of advanced technologies propelled ZTE's product offerings, establishing the company as a prominent player in the industry.

2. Merck Sharp & Dohme Corporation:

Liu's foray into the pharmaceutical industry brought him to Merck Sharp & Dohme Corporation, where he applied his engineering skills to optimize manufacturing processes and enhance equipment design. His involvement in automated systems and innovative solutions ensured operational efficiencies and high-quality pharmaceutical product output.

Collaborations:

Throughout his career, Kun Liu has had the opportunity to collaborate with talented individuals. Some of his notable coworkers include:

1. Bo Dai:

Working alongside Bo Dai, another expert in the telecommunications field, Liu indulged in groundbreaking research and development projects. Together, their collective expertise contributed to the creation of several patents, revolutionizing information transmission and communication technologies.

2. Huiying Fang:

Liu's collaboration with Huiying Fang, an accomplished engineer specialized in manufacturing and assembly processes, resulted in remarkable advancements in backplane connector design. Their combined efforts led to patents that enhanced connector performance and reliability.

Conclusion:

Kun Liu's vast portfolio of patents showcases his brilliance and passion for innovation in the telecommunications sector. Through his expertise in information transmission methods and connector design, Liu has contributed substantially to the advancement of communication networks. His collaborations with esteemed companies and skilled coworkers have further solidified his reputation as a leading innovator in Shenzhen. As he continues to push the boundaries of technological possibilities, the industry eagerly awaits his next groundbreaking invention.

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