Kun-Han Hsieh

Title: Kun-Han Hsieh: Innovator in Semiconductor Testing Technology

Introduction

Kun-Han Hsieh is a notable inventor based in Chu-Pei, Taiwan. He has made significant contributions to the field of semiconductor testing, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of testing technologies used in the semiconductor industry.

Latest Patents

Hsieh's latest patents include a "Circuit board for semiconductor test" and a "Method for making support structure for probing device." The circuit board patent describes a design that incorporates first and second sub-circuit boards with an insulating dielectric layer in between. This innovative design allows for improved power test uniformity by connecting the lower contacts of the first sub-circuit board to a probe head and the upper contacts of the second sub-circuit board to a tester. The method for making a support structure for a probing device outlines a process that involves a substrate with internal conductive lines and a carrier for packaging an integrated circuit chip, ensuring effective electrical connections through soldering.

Career Highlights

Kun-Han Hsieh is currently employed at Mpi Corporation, where he continues to develop cutting-edge technologies in semiconductor testing. His work has been instrumental in advancing the capabilities of testing equipment, making it more reliable and efficient.

Collaborations

Hsieh collaborates with talented coworkers, including Shih-Ching Chen and Jun-Liang Lai, who contribute to the innovative projects at Mpi Corporation.

Conclusion

Kun-Han Hsieh's contributions to semiconductor testing technology through his patents and work at Mpi Corporation highlight his role as a key innovator in the field. His advancements are paving the way for more efficient testing methods in the semiconductor industry.