The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Jan. 20, 2015
Mpi Corporation, Chu-Pei, Hsinchu Shien, TW;
Kun-Han Hsieh, Chu-Pei, TW;
Huo-Kang Hsu, Chu-Pei, TW;
Kuan-Chun Chou, Chu-Pei, TW;
Tsung-Yi Chen, Chu-Pei, TW;
Chung-Tse Lee, Chu-Pei, TW;
MPI Corporation, Chu-Pei, Hsinchu Shien, TW;
Abstract
A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.