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For the Inventor, By the Inventor

San Diego, CA, United States of America

Kun Fang

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:

goldMedal9 out of 41,326 
 
Qualcomm Incorporated
 patents

Years Active: 2021-2025

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9 patents (USPTO):
1. 12300873 - Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods (2025-05-13),
2. 12126071 - Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods (2024-10-22),
3. 12125742 - Package comprising a substrate with high density interconnects (2024-10-22),
4. 11869833 - Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same (2024-01-09),
5. 11823983 - Package with a substrate comprising pad-on-pad interconnects (2023-11-21),
6. 11551939 - Substrate comprising interconnects embedded in a solder resist layer (2023-01-10),
7. 11545425 - Substrate comprising interconnects embedded in a solder resist layer (2023-01-03),
8. 11439008 - Package with substrate comprising variable thickness solder resist layer (2022-09-06),
9. 11183446 - X.5 layer substrate (2021-11-23),

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