Location History:
- Taipei Hsien, TW (2012 - 2013)
- Tu-Cheng, TW (2013)
- New Taipei, TW (2013 - 2021)
Company Filing History:
20 out of 19,782 
1 out of 78 
1 out of 147 Years Active: 2012-2021
Title: Innovations and Contributions of Kun-Chan Wu
Introduction
Kun-Chan Wu is an influential inventor based in Taipei Hsien, Taiwan. With a remarkable portfolio of 22 patents, he has made significant contributions to the fields of integrated device technology and light reflection materials. His inventions reflect a deep understanding of both theoretical and practical aspects of engineering and design.
Latest Patents
Among his latest innovations is an "Integration Device for Integrating Function Modules." This device comprises a control module housed within a 3D object, featuring various assembling slots for function modules. Each module communicates with the control module via connecting ports, allowing seamless integration with IoT apparatuses.
Another notable patent is the "Light Reflection Film and Method of Manufacturing the Same." This technology involves a novel method for creating a light reflection film using a precursor that combines white pigments and liquid UV curing material. The process includes a series of steps that ensure even dispersion of pigments and resulting in a high-quality reflective film.
Career Highlights
Kun-Chan Wu has held positions in prestigious companies such as Hon Hai Precision Industry Co., Ltd. and Jess-Link Products Co., Ltd. His roles in these organizations have allowed him to lead innovative projects and enhance product development processes.
Collaborations
Throughout his career, Kun-Chan has partnered with noteworthy colleagues, including Tai-Cherng Yu and I-Thun Lin. These collaborations have fostered a creative environment, leading to the development of groundbreaking technologies and patents.
Conclusion
Kun-Chan Wu's dedication to innovation is evident in his extensive patent portfolio and his contributions to technology. His work not only demonstrates his expertise but also paves the way for future advancements in integrated devices and material science. His collaborations and career achievements serve as an inspiration for aspiring inventors and engineers worldwide.