This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2018.
Company Filing History:
Years Active: 2018
Title: Kuang Ming Lee - Innovator in Semiconductor Handling Technology
Introduction
Kuang Ming Lee is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly in the handling of semiconductor dies. His innovative approach has led to the development of a unique assembly that enhances the efficiency of semiconductor handling processes.
Latest Patents
Kuang Ming Lee holds a patent for an "Assembly for handling a semiconductor die and method of handling a semiconductor die." This invention includes a carrier with a surface and an adhesive tape fixed to that surface. The adhesive tape is designed to adhere to the semiconductor die, and its adhesion can be reduced using electromagnetic waves. The assembly also features an electromagnetic source that applies these waves to decrease the adhesion of the tape, facilitating the pick-up of the semiconductor die by a die pick-up component. This innovative solution addresses challenges in semiconductor handling and improves operational efficiency.
Career Highlights
Kuang Ming Lee is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to collaborate with other talented professionals in the industry, contributing to advancements in semiconductor technology.
Collaborations
Some of his coworkers include Ronald Paramio Joves and Thanabal Ganesh Kunamani. Their collaboration fosters a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
In summary, Kuang Ming Lee is a distinguished inventor whose work in semiconductor handling technology has made a significant impact in the field. His innovative patent and contributions at Infineon Technologies AG highlight his commitment to advancing semiconductor solutions.