The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Aug. 14, 2015
Infineon Technologies Ag, Neubiberg, DE;
Ronald Paramio Joves, Melaka, MY;
Thanabal Ganesh Kunamani, Seremban, MY;
Kuang Ming Lee, Melaka, MY;
Avelino Oliveros Sumagpoa, Melaka, MY;
Kian Heong Tan, Melaka, MY;
Nestor Vergara Bicomong, Melaka, MY;
Jagen Krishnan, Muar, MY;
Soon Hock Tong, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.