Kuang-Chwn Chou

Title: Kuang-Chwn Chou: Innovator in Semiconductor Packaging

Introduction

Kuang-Chwn Chou is a prominent inventor based in Kaohsiung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work has been instrumental in advancing technology in this critical area.

Latest Patents

Kuang-Chwn Chou holds a patent for a "Stacked Structure of Semiconductor Package." This invention primarily comprises a first chip, a second chip, a substrate, and a lead frame. The first and second chips are attached to the substrate's surface using solder bumps through flip-chip bonding. This configuration allows the chips and substrate to form a stacked structure. The design includes plugs along the substrate's edge that connect to receptacles of the lead frame, facilitating the creation of a semiconductor device. The lead frame is bent to form fingers that are positioned within the assembly, ensuring that the chips can operate effectively. An encapsulant covers the stacked structure, with the fingers exposed for operational access.

Career Highlights

Kuang-Chwn Chou is associated with Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has garnered attention for its practical applications and efficiency in semiconductor packaging.

Collaborations

He has collaborated with notable coworkers, including Chun-Chi Lee and Kuang-Lin Lo, contributing to various projects that enhance semiconductor technology.

Conclusion

Kuang-Chwn Chou's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work continues to influence the industry and inspire future innovations.