Taipei, Taiwan

Kuang-Chen Wu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Chiun Mai Communication Systems, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuang-Chen Wu. Retrieved from https://idiyas.com/inventor/kuang-chen-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kuang-Chen Wu: Innovator in Heat Dissipation Technology

Introduction

Kuang-Chen Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technology, particularly through his innovative designs that enhance the performance of electronic devices.

Latest Patents

Wu holds a patent for a "Heat dissipation module and antenna array device having same." This invention includes a heat dissipation module that features a body with multiple heat-conducting structures arranged in an array. The antenna array device, which applies this heat dissipation module, consists of an upper cover and a circuit board. The design aims to improve the efficiency of heat management in electronic systems.

Career Highlights

Kuang-Chen Wu is currently employed at Chiun Mai Communication Systems, Inc. His work focuses on developing advanced communication technologies that require effective thermal management solutions. His innovative approach has positioned him as a key player in the industry.

Collaborations

Wu collaborates with talented colleagues, including Chun-Chih Chen and Po-Ching Huang. Together, they work on projects that push the boundaries of technology and improve product performance.

Conclusion

Kuang-Chen Wu's contributions to heat dissipation technology exemplify the importance of innovation in the electronics industry. His patent and collaborative efforts continue to influence advancements in communication systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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