The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Aug. 29, 2024
Applicant:

Chiun Mai Communication Systems, Inc., New Taipei, TW;

Inventors:

Chun-Chih Chen, New Taipei, TW;

Kuang-Chen Wu, New Taipei, TW;

Ke-Xuan Luo, New Taipei, TW;

PO-Ching Huang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 1/12 (2006.01); H01Q 1/42 (2006.01); H01Q 3/36 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01Q 1/125 (2013.01); H01Q 1/42 (2013.01); H01Q 3/36 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A heat dissipation module and an antenna array device applying the heat dissipation module are provided, the antenna array device includes an upper cover and a circuit board, the heat dissipation module includes a body; a plurality of heat-conducting structures arranged in an array on one side of the body; a plurality of supporting structures supporting the circuit board, the plurality of heat-conducting structures and the plurality of supporting structures arranged on a same side of the body; and a plurality of connecting structures arranged on an edge of the body and connected to the upper cover.


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