Hsin-Chu, Taiwan

Kuan Teng Lo


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Kuan Teng Lo: Innovator in Semiconductor Process Control

Introduction

Kuan Teng Lo is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor process control, particularly through his innovative patent. His work focuses on enhancing the efficiency and uniformity of semiconductor wafer processing.

Latest Patents

Kuan Teng Lo holds a patent titled "Clustering for prediction models in process control and for optimal dispatching." This patent describes a method for semiconductor process control that involves clustering processing tools into a tool cluster based on processing data. It also details the formation of a prediction model for processing semiconductor wafers based on the tool cluster. The patent includes a second embodiment that provides cluster routes between first and second stage tool clusters, assigning a comparative optimization ranking to each route. This ranking helps in scheduling wafer processing to ensure high uniformity.

Career Highlights

Kuan Teng Lo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor technology.

Collaborations

Kuan Teng Lo has collaborated with notable colleagues such as Jung Cheng Ko and Tzu-Yu Wang. These collaborations have likely enriched his work and contributed to the development of his patent.

Conclusion

Kuan Teng Lo is a prominent figure in the semiconductor industry, recognized for his innovative approach to process control. His patent reflects his commitment to improving wafer processing efficiency and uniformity. His contributions continue to influence the field of semiconductor technology.

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