Company Filing History:
Years Active: 2002-2005
Title: Inventor Kuan-Neng Liao: Pioneering Innovations in IC Packaging
Introduction
Kuan-Neng Liao, an accomplished inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of semiconductor technology. With a portfolio of four patents, Liao is recognized for his innovative methods that enhance thermal management in integrated circuits.
Latest Patents
Liao's latest inventions showcase his expertise in improving heat dissipation in electronic components. One of his notable patents is a "Method of attaching a heat sink to an IC package," which outlines an improved technique for integrally attaching a heat sink. This method focuses on enhancing the thermal conductivity of IC packages by utilizing a heat sink matrix, which is divided into individual heat sinks. These are simultaneously cut and attached to an IC package matrix during processing, ensuring superior thermal performance.
Another significant patent is the "Structure and package of a heat spreader substrate." This patent presents a novel structure where a first heat spreader contains an opening that tightly fits a second, thinner heat spreader. This innovative design allows for optimal placement of chips, improving heat management and functionality in semiconductor devices.
Career Highlights
Liao is currently associated with Advanced Semiconductor Engineering, Inc., where he applies his inventive skills to push the boundaries of semiconductor technology. His work at the company underscores his commitment to improving the efficiency and performance of integrated circuits.
Collaborations
Throughout his career, Liao has collaborated with notable colleagues such as Shin-Hua Chao and Yao-Hsin Feng. These collaborations have played a crucial role in developing cutting-edge solutions that address industry challenges in thermal management and productivity in semiconductor manufacturing.
Conclusion
Kuan-Neng Liao stands out as a key inventor in the semiconductor industry, demonstrating a profound ability to innovate and create solutions that enhance product performance. His dedication to research and development, along with active contributions to patents, continues to shape the future of integrated circuit technology.