The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Jan. 17, 2003
Shin-hua Chao, Kaohsiung, TW;
Shyh-ing Wu, Kaohsiung Hsien, TW;
Kuan-neng Liao, Kaohsiung, TW;
Gin-nan Yeh, Tainan, TW;
Shin-Hua Chao, Kaohsiung, TW;
Shyh-Ing Wu, Kaohsiung Hsien, TW;
Kuan-Neng Liao, Kaohsiung, TW;
Gin-Nan Yeh, Tainan, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.