Kuan-Min Wang

Title: Kuan-Min Wang: Innovator in Semiconductor Packaging

Introduction

Kuan-Min Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise.

Latest Patents

Wang holds a patent for a "Package structure having lid with protrusion and manufacturing method thereof." This invention involves a semiconductor package that includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate, while the lid covers both the semiconductor die and the substrate. The adhesive layer, which is sandwiched between the lid and the semiconductor die, consists of a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to it. Notably, the polymeric TIM layer is strategically located on the corners of the semiconductor die when viewed from above. This innovative design enhances the thermal management of semiconductor devices.

Career Highlights

Kuan-Min Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.

Collaborations

Wang has collaborated with esteemed colleagues such as Chang-Jung Hsueh and Jui-Chang Chuang, contributing to a dynamic and innovative work environment.

Conclusion

Kuan-Min Wang's contributions to semiconductor packaging exemplify his dedication to innovation and excellence in technology. His patent reflects a significant advancement in the field, and his ongoing work at Taiwan Semiconductor Manufacturing Company Limited positions him as a key player in the industry.