Taiwan Semiconductor Manufacturing Comp. Ltd.

Kuan-Min Wang

Kuo-Chin Chang

Chang-Jung Hsueh

Wei-Hung Lin

Jui-Chang Chuang

A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Growing community of inventors

Hsinchu, Taiwan

Kuan-Min Wang