Taipei, Taiwan

Kuan-Lin Chu

This inventor holds 1 USPTO granted patent. Top assignee: National Taiwan University of Science and Technology. Active years: 2026.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kuan-Lin Chu: Innovator in Atomic Layer Deposition Technology

Introduction

Kuan-Lin Chu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of atomic layer deposition, a crucial technology in various industrial applications. His innovative approach has the potential to enhance the efficiency and effectiveness of deposition processes.

Latest Patents

Kuan-Lin Chu holds a patent for an atomic layer deposition method. This method involves exposing a carrier to moisture, allowing a hydroxy group to be distributed on the surface of the carrier. Subsequently, a liquid precursor is added to the hydroxy group to perform an alcohol condensation reaction, resulting in the formation of a target atom layer or a target atom compound layer on the deposition carrier. This process offers several advantages over existing low-yield dry atomic deposition technologies. It eliminates limitations on the volume of the reaction chamber and simplifies the process, allowing for a continuous design that enhances industrial applicability.

Career Highlights

Kuan-Lin Chu is affiliated with the National Taiwan University of Science and Technology, where he continues to advance his research and development efforts. His work is characterized by a commitment to innovation and practical applications in the field of material science.

Collaborations

Kuan-Lin Chu has collaborated with notable colleagues, including Wei-nien Su and Ping-Chun Tsai. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise.

Conclusion

Kuan-Lin Chu's contributions to atomic layer deposition technology exemplify the spirit of innovation in the field. His patented method not only addresses existing challenges but also paves the way for broader industrial applications. His work continues to inspire advancements in material science and engineering.

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