Location History:
- New Taipei, TW (2017)
- Hsinchu, TW (2024)
Company Filing History:
2 out of 40,927 
1 out of 4,316 
Years Active: 2017-2025
Title: Kuan-Hsien Lee: Innovator in Wafer Bonding Technology
Introduction
Kuan-Hsien Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding processes. With a total of 3 patents to his name, Lee's work has advanced the efficiency and effectiveness of semiconductor manufacturing.
Latest Patents
One of Kuan-Hsien Lee's latest patents is focused on an extended seal ring structure on wafer-stacking. This innovation involves a wafer-on-wafer bonding technique where each wafer is equipped with a seal ring structure around the die areas defined in the wafer. The embodiments of this patent provide a further seal ring that spans the interface between the wafers. Additionally, the invention may extend the existing seal rings of the wafers or provide an extended seal ring structure that is separate from the existing seal rings, or combinations thereof.
Career Highlights
Throughout his career, Kuan-Hsien Lee has worked with notable organizations, including Taiwan Semiconductor Manufacturing Company Ltd. and Tsinghua University. His experience in these institutions has allowed him to refine his expertise in semiconductor technologies and contribute to groundbreaking innovations.
Collaborations
Kuan-Hsien Lee has collaborated with esteemed colleagues such as Shih-Hsorng Shen and Sheng-Shian Li. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Kuan-Hsien Lee's contributions to wafer bonding technology exemplify his innovative spirit and dedication to advancing semiconductor manufacturing. His patents and collaborations reflect a commitment to excellence in the field.