The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Jul. 24, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Shih-Hsorng Shen, Hsinchu, TW;
Kuan-Hsien Lee, New Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2005.12); H01L 21/78 (2005.12); H01L 23/00 (2005.12); H01L 23/31 (2005.12); H01L 23/58 (2005.12); H01L 25/00 (2005.12); H01L 25/065 (2022.12);
U.S. Cl.
CPC ...
H01L 23/562 (2012.12); H01L 21/78 (2012.12); H01L 23/564 (2012.12); H01L 23/585 (2012.12); H01L 24/08 (2012.12); H01L 24/80 (2012.12); H01L 25/0657 (2012.12); H01L 25/50 (2012.12); H01L 2224/08145 (2012.12); H01L 2224/80895 (2012.12); H01L 2224/80896 (2012.12); H01L 2924/3511 (2012.12);
Abstract
Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers, or combinations thereof.