Company Filing History:
Years Active: 2003
Title: Ku Sun Hong: Innovator in Semiconductor Packaging
Introduction
Ku Sun Hong is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to manufacturing processes.
Latest Patents
One of his latest patents is an "Apparatus for manufacturing semiconductor packages." This invention features a mold designed to facilitate the easy separation of leadframes from a top mold section after the molding process. The mold includes a bottom section with housing parts that allow leadframes to be placed flat, while the top mold incorporates transports and runners to introduce encapsulation material into specific regions. Eject pins are mounted in the top mold section to aid in the separation of leadframes.
Another notable patent is for a "Semiconductor device having increased moisture path and increased solder joint strength." This patent describes a semiconductor package with a planar die pad connected to a leadframe by tie bars. The die pad's perimeter is half-etched to enhance moisture-permeation paths. The design includes rectangular leads extending from the leadframe toward the die pad, ensuring they do not contact the pad. The package undergoes various treatments to restore the internal leads' color and is plated with materials to form a protective layer.
Career Highlights
Ku Sun Hong is currently employed at Amkor Technology, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has significantly impacted the efficiency and reliability of semiconductor devices.
Collaborations
He collaborates with talented coworkers, including Hyung Ju Lee and Young Suk Chung, who contribute to the innovative environment at Amkor Technology, Inc.
Conclusion
Ku Sun Hong's contributions to semiconductor packaging through his patents reflect his dedication to innovation in the field. His work continues to influence the industry, enhancing the performance and reliability of semiconductor devices.