Amkor Technology, Inc.

Ku Sun Hong

Hyung Ju Lee

Jung Woo Lee

Jae Jin Lee

Jae Hak Yee

Jae Hun Ku

Young Suk Chung

Sung Sik Jang

Tae Heon Lee

Mu Hwan Seo

A mold for manufacturing semiconductor packages, which allows leadframes to be easily separated from a top mold section after a molding process by utilizing eject pins therein. The mold includes a bottom mold section having housing parts on the upper surface so as to allow leadframes to be placed in a flat state therein, and a top mold formed with transports therethrough. The top mold also incorporates runners formed along a lower surface with connections to the transports to introduce encapsulation material into select regions. A plurality of gates and cavities for molding the semiconductor packages are in flow communication. The eject pins are reciprocally mounted in the top mold section contiguous with the runners thereof to facilitate separation of the leadframes from the top mold.

Apparatus for manufacturing semiconductor packages

Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H SO )-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer. The singulation step comprises forming a burr at a peripheral side surface of the leads in the upward direction. The finished package may be marked with a recognition mark to enable a user to more easily identify the first lead.

Semiconductor device having increased moisture path and increased solder joint strength

Growing community of inventors

Seoul, South Korea

Ku Sun Hong