Hsinchu, Taiwan

Kow-Liang Wen

This inventor holds 2 USPTO granted patents. Top assignee: Winbond Electronics Corporation. Active years: 1998-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kow-Liang Wen. Retrieved from https://idiyas.com/inventor/kow-liang-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1998-1999

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2 patents (USPTO):Explore Patents

Title: Kow-Liang Wen: Innovator in Integrated Circuit Technology

Introduction

Kow-Liang Wen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

Wen's latest patents include innovations that address critical challenges in memory storage and electrostatic discharge protection. One of his notable inventions is a high storage capacity, wide data input/output channel SRAM. This SRAM features a 64-bit wide data input/output channel and offers either 4 Mbyte or 2 Mbyte of memory. It is designed to be packaged as a 100-pin QFP or TQFP, serving as a substitute for conventional 128 pin QFP or TQFP SRAM. This invention not only incorporates all necessary functions, including pipeline burst transmission, but also reduces package testing and production costs.

Another significant patent is a method for preventing electrostatic discharge failure in integrated circuits. This invention involves an integrated circuit package that includes a semiconductor chip with bonding pads, wired pins, and at least one non-wired pin. The non-wired pin is electrically connected to an adjacent wired pin, effectively preventing electrostatic discharge failure in the package.

Career Highlights

Kow-Liang Wen is currently employed at Winbond Electronics Corporation, a leading company in the semiconductor industry. His work at Winbond has allowed him to apply his innovative ideas and contribute to the development of advanced electronic components.

Collaborations

Wen has collaborated with several talented individuals in his field, including Hung-Hsueh Lin and Hsin-Chang Lin. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Kow-Liang Wen's contributions to integrated circuit technology exemplify the spirit of innovation. His patents not only enhance the functionality of semiconductor devices but also address critical industry challenges. His work continues to influence the field and inspire future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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