Tsukuba, Japan

Kousuke Hiroki

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kousuke Hiroki. Retrieved from https://idiyas.com/inventor/kousuke-hiroki-ebldt5zu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 7.0

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Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Kousuke Hiroki: Innovator in Multi-Layer Wiring Technology

Introduction

Kousuke Hiroki is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to multi-layer wiring boards.

Latest Patents

Hiroki holds a patent for a connection board and multi-layer wiring board, which includes a substrate for semiconductor packages. The patent describes a manufacturing method that involves preparing connection boards with an insulating resin composition layer, a connection conductor, and a conductor circuit. The method aligns and laminates these connection boards through heating and pressing, ensuring conductive and mechanical connections between the components.

Career Highlights

Kousuke Hiroki is associated with Hitachi Chemical Company, Ltd., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the manufacturing processes of multi-layer wiring boards, which are crucial for modern electronic devices.

Collaborations

Hiroki collaborates with notable colleagues, including Hidehiro Nakamura and Akishi Nakaso. Their combined efforts contribute to the innovative projects at Hitachi Chemical Company, enhancing the company's reputation in the semiconductor industry.

Conclusion

Kousuke Hiroki's contributions to the field of semiconductor technology through his patent and work at Hitachi Chemical Company, Ltd. highlight his role as an influential inventor. His innovative methods in manufacturing multi-layer wiring boards are paving the way for advancements in electronic device technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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