The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jul. 10, 2007
Hidehiro Nakamura, Tsukuba, JP;
Akishi Nakaso, Oyama, JP;
Shigeharu Arike, Nogi-machi, JP;
Fumio Inoue, Tsukuba, JP;
Tetsuya Enomoto, Tsukuba, JP;
Norio Moriike, Shimodate, JP;
Kousuke Hiroki, Tsukuba, JP;
Hidehiro Nakamura, Tsukuba, JP;
Akishi Nakaso, Oyama, JP;
Shigeharu Arike, Nogi-machi, JP;
Fumio Inoue, Tsukuba, JP;
Tetsuya Enomoto, Tsukuba, JP;
Norio Moriike, Shimodate, JP;
Kousuke Hiroki, Tsukuba, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.