Kouji Senda

Title: Kouji Senda: Innovator in Articulation Devices and Direct Bonding Technologies

Introduction

Kouji Senda is a notable inventor based in Oobu, Japan. He has made significant contributions to the field of engineering, particularly in the development of articulation devices and methods for direct bonding of materials. With a total of two patents to his name, Senda's work showcases his innovative approach to solving complex engineering challenges.

Latest Patents

Senda's latest patents include an articulation device and a method and apparatus for direct bonding two bodies. The articulation device features a moving member that is rotatably and slidably arranged in a holder with a spherical inner surface. This device utilizes a piezoelectric actuator to facilitate movement, allowing for precise control over the interaction between the inertia body and the moving member. The second patent focuses on a method for directly bonding two bodies in a vacuum chamber, employing low energy ion etching and a unique water molecule beam to prepare the surfaces for bonding.

Career Highlights

Kouji Senda is currently associated with Nippondenso Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of articulation devices and bonding techniques, which have applications in various industries.

Collaborations

Senda has collaborated with notable colleagues such as Masao Nagakubo and Seiji Fujino. These partnerships have contributed to the successful development of his patents and have fostered a collaborative environment for innovation.

Conclusion

Kouji Senda's contributions to the fields of articulation devices and direct bonding technologies highlight his role as a significant inventor. His innovative patents reflect a commitment to advancing engineering solutions that can have a lasting impact on various industries.