Nippondenso Co., Ltd.

Kouji Senda

Tadashi Hattori

Takashi Kaneko

Takaharu Idogaki

Seiji Fujino

Masao Nagakubo

Takayuki Tominaga

Hitoshi Kanayama

A moving member 2 is rotatably and slidably arranged in a holder 11 having a spherical inner surface 11a. An inertia body 5 is connected to the moving member 2 via a supporting member 4. At a location opposite the inertia body 5, an arm 3 extends so that it is directed outwardly via an opening of the holder. A piezo electric actuator 63 is arranged between the rotating member 2 and the supporting member 4. An elongation of the actuator causes a relative swing movement between the inertia body 5 and moving member to occur in one direction such that a reaction force in the moving member 2 due to the inertia of the inertia body 5 exceeds the frictional force between the moving member 4 and the holder 11, which allows the moving member 4 to be displaced with respect to the holder 11. A contraction of the actuator causes a relative movement between the inertia body 5 and moving member to occur in the opposite direction such that a reaction force in the moving member 2 does not exceed the frictional force, which allows the inertia body to follow with the actuator 63. A reception of the elongation and the contraction allows a movement of the moving member to occur so that it exceeds the limit of the bonding movement of the actuator.

Articulation device

Bodies of at least one material are held in a contacting holder 12 in a vacuum chamber. The surfaces of the bodies are cleaned by a low energy ion etching. Water vapor from a pure water bottle is supplied through a nozzle as a water molecule beam so that water molecules and hydroxide groups are chemically adsorbed on the surfaces of the bodies. A plasma beam or microwaves are applied to the surfaces of the bodies to remove the water molecules and leave only hydroxide groups remaining on the surfaces. The holder is operated to bring the surfaces of the bodies into contact with each other, to thereby obtain direct bonding of the bodies.

Method and apparatus for direct bonding two bodies

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Oobu, Japan

Kouji Senda