This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2001.
Company Filing History:
Years Active: 2001
Title: Kouichiro Nomoto: Innovator in Windowed Packaging Technology
Introduction
Kouichiro Nomoto is a notable inventor based in Kagoshima, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance the functionality and durability of packaging solutions.
Latest Patents
Nomoto holds a patent for a "Mass reflowable windowed package." This invention is designed to withstand the mass reflow process, where the entire package is exposed to solder reflow temperatures. In one embodiment of the patent, the lid features a ceramic frame and a glass window, providing both strength and transparency.
Career Highlights
Kouichiro Nomoto is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies. His work at Intel has allowed him to be at the forefront of advancements in packaging solutions, contributing to the company's reputation for innovation.
Collaborations
Throughout his career, Nomoto has collaborated with esteemed colleagues, including Kabul S Sengupta and Carl E Sklenicka. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.
Conclusion
Kouichiro Nomoto's contributions to packaging technology, particularly through his patented designs, highlight his role as an innovator in the field. His work at Intel Corporation and collaborations with other professionals further emphasize his impact on the industry.