Kota Sugisawa

Title: Kota Sugisawa: Innovator in Solder Technology

Introduction

Kota Sugisawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder technology, particularly in developing lead-free and antimony-free solder alloys. With a total of 2 patents to his name, Sugisawa's work is recognized for its innovative approach to improving solder materials.

Latest Patents

Sugisawa's latest patents include advancements in solder alloy, solder ball, and solder joint technologies. One of his notable inventions employs a lead-free and antimony-free solder alloy with a specific composition that includes 1.0% to 4.0% by mass of silver (Ag), 0.1% to 1.0% by mass of copper (Cu), 0.1% to 9.0% by mass of bismuth (Bi), 0.005% to 0.3% by mass of nickel (Ni), and 0.001% to 0.015% by mass of germanium (Ge), with the balance being tin (Sn). Another patent focuses on a solder alloy, solder paste, and solder joint that exhibit a suitable melting temperature, excellent wettability, high tensile strength, shear strength, and remarkable drop impact resistance.

Career Highlights

Sugisawa is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the solder industry. His work has been instrumental in advancing the performance and reliability of solder materials used in various applications.

Collaborations

Some of his notable coworkers include Yuki Iijima and Takahiro Matsufuji, who contribute to the collaborative efforts in research and development at Senju Metal Industry Co., Ltd.

Conclusion

Kota Sugisawa's contributions to solder technology reflect his commitment to innovation and excellence. His patents not only enhance the performance of solder materials but also pave the way for future advancements in the industry.