The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Nov. 17, 2021
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Yuki Iijima, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Kanta Dei, Tokyo, JP;
Takahiro Matsufuji, Tokyo, JP;
Kota Sugisawa, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 13/02 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0244 (2013.01); C22C 13/02 (2013.01); B23K 2101/40 (2018.08);
Abstract
The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.