Okayama, Japan

Kosuke Moriya


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 51(Granted Patents)


Company Filing History:


Years Active: 1988

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2 patents (USPTO):Explore Patents

Title: Innovations by Kosuke Moriya

Introduction

Kosuke Moriya is a notable inventor based in Okayama, Japan. He has made significant contributions to the field of printed circuit board technology. With a total of 2 patents, Moriya's work focuses on enhancing the materials used in electronic components.

Latest Patents

Moriya's latest patents include a flexible printed circuit board base material and a printed circuit board base material. The flexible printed circuit board base material involves a sheet of porous, expanded polytetrafluoroethylene that is impregnated with a bismaleimide-triazine resin, which is then cured. This innovative material can be laminated to glass cloth, allowing for the production of composites with multiple layers. The printed circuit board base material consists of minute fragments of expanded, porous polytetrafluoroethylene mixed uniformly into another resin, which is compressed to form a composite board. This board is designed to have an electrically conductive circuit affixed to at least one surface, with the resin potentially being epoxy, polyester, or similar types.

Career Highlights

Kosuke Moriya is currently employed at Japan Gore-tex Inc., where he continues to develop advanced materials for electronic applications. His work has been instrumental in improving the performance and reliability of printed circuit boards.

Collaborations

Moriya collaborates with talented individuals such as Minoru Hatakeyama and Ichiro Komada, contributing to a dynamic team focused on innovation in material science.

Conclusion

Kosuke Moriya's contributions to the field of printed circuit board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material properties and their applications in electronics.

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