Japan Gore-tex Inc.

Kosuke Moriya

Minoru Hatakeyama

Ichiro Komada

A flexible base material for use in printed circuit boards is provided wherein a sheet of porous, expanded polytetrafluoroethylene is impregnated with a bismaleimide-triazine resin, and the resin is cured therein. The sheet may be laminated to a glass cloth and composites may be produced having a multiplicity of layers of such sheets and glass cloths.

Flexible printed circuit board base material

A base material for use in making printed circuit boards is provided wherein minute fragments of expanded, porous polytetrafluoroethylene are uniformly mixed into another resin, and the mixture is compressed to form a composite board. In use, the board has an electrically conductive circuit affixed to at least one surface. The other resin may be epoxy, polyester or other similar resin. Laminates of such base board material affixed to a glass cloth or paper sheet may be prepared. The preferred fragment size range is 0.1 to 5 mm average diameter, and the preferred volume ratio of fragments to resin is 0.5 to 2.0.

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Okayama, Japan

Kosuke Moriya