Kosaku Harayama

Title: Innovations by Kosaku Harayama

Introduction

Kosaku Harayama is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of electrical engineering, particularly in the area of wiring methods on insulating substrates. His innovative approach has led to the development of a unique patent that enhances the efficiency of wiring formation.

Latest Patents

Harayama holds a patent for a "Method for forming wiring on insulating resin layer." This method involves several steps, including laminating a thermosetting resin film and a metallic foil on an insulating substrate. The process includes pressing the film and foil with heat, forming openings in the metallic foil, and creating via holes in the insulating resin layer. The method also incorporates a desmear process and the formation of electroless-plated and electroplated layers, which are crucial for effective wiring.

Career Highlights

Kosaku Harayama is associated with Shinko Electric Industries Co., Ltd., where he has been instrumental in advancing wiring technologies. His work has not only contributed to the company's success but has also set new standards in the industry. Harayama's innovative methods are recognized for their practicality and effectiveness in modern applications.

Collaborations

Throughout his career, Harayama has collaborated with talented individuals such as Takaharu Yamano and Hiroyuki Kato. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Kosaku Harayama's contributions to the field of electrical engineering through his patent and work at Shinko Electric Industries Co., Ltd. highlight his role as a significant inventor. His innovative methods for wiring formation continue to influence the industry positively.