Kook Hyun Sunwoo

Title: Kook Hyun Sunwoo: Innovator in Wafer Level Packaging Technology

Introduction

Kook Hyun Sunwoo is a prominent inventor based in Choongchungnam-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in wafer level packaging (WLP). With a total of 4 patents to his name, Sunwoo continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is a "Wafer level package fabrication method using laser illumination." This invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The method allows for rapid welding of bonding metal strips between the device and lid wafers, effectively sealing an internal cavity without causing thermal effects to the drive unit in the device wafer.

Another notable patent is for an "FBAR, FBAR based duplexer device and manufacturing method thereof." This invention involves a film bulk acoustic resonator (FBAR) and an FBAR-based duplexer device. The manufacturing method includes forming a plurality of sacrificial layer units on a substrate wafer, spaced apart at regular distances, with device functional portions formed on these layers. The device functional portions consist of a piezoelectric layer unit and multiple electrodes, with protective side walls and roofs created using dry film.

Career Highlights

Kook Hyun Sunwoo is currently employed at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in semiconductor technologies. His work has been instrumental in advancing the capabilities of wafer level packaging, which is crucial for modern electronic devices.

Collaborations

Throughout his career, Sunwoo has collaborated with notable colleagues, including Jong Oh Kwon and Je Hong Kyoung. These partnerships have fostered a collaborative environment that enhances innovation and development in their projects.

Conclusion

Kook Hyun Sunwoo is a key figure in the field of semiconductor technology, with a focus on wafer level packaging innovations. His contributions through patents and collaborations continue to shape the future of electronic device manufacturing.