The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
Nov. 04, 2004
Applicants:
Kook Hyun Sunwoo, Choongchungnam-do, KR;
Jong OH Kwon, Kyungki-do, KR;
Joo Ho Lee, Seoul, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Kyungki-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/32 (2006.01); B23K 101/40 (2006.01); H01L 21/00 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.
Sunwoo, Kook. (2007). Wafer level package fabrication method using laser illumination (U.S. Patent No. 7241966). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7241966
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile