Malacca, Malaysia

Kooi Choon Ooi

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: National Semiconductor Corporation, Texas Instruments Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kooi Choon Ooi. Retrieved from https://idiyas.com/inventor/kooi-choon-ooi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Kooi Choon Ooi: Innovator in Semiconductor Technology

Introduction

Kooi Choon Ooi is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is an exposed die package that helps protect the exposed die from damage. This invention describes an integrated circuit package with an exposed die and a protective housing that extends beyond the exposed back surface of the die. This design helps to protect the die from damage, ensuring its longevity and reliability. The integrated circuit package includes a lead frame and an integrated circuit die, which is electrically and physically attached to the lead frame. The housing encapsulates both the lead frame and the die, featuring a recessed region at the bottom where the back surface of the die is exposed. Additionally, a protruding protective structure at the bottom of the package prevents the exposed back surface from coming into contact with external objects.

Another significant patent by Ooi is a method and apparatus for dicing die attach film on a semiconductor wafer. This invention outlines a method of sawing a semiconductor wafer using a sawing blade and a movable support structure. The semiconductor wafer is coupled with the support structure through various layers, including a die attach film, adhesive, and base film. During the cutting operation, the sawing blade engages one of the layers while the support structure moves in the opposite direction, enhancing the efficiency of the sawing process.

Career Highlights

Throughout his career, Kooi Choon Ooi has worked with prominent companies in the semiconductor industry, including Texas Instruments Corporation and National Semiconductor Corporation. His experience in these organizations has contributed to his expertise and innovative capabilities in the field.

Collaborations

Ooi has collaborated with several talented individuals, including Kok Leong Yeo and Lee Han Meng Eugene Lee. These collaborations have likely fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Kooi Choon Ooi is a distinguished inventor whose work in semiconductor technology has led to valuable patents that enhance the protection and efficiency of integrated circuit packages. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…