The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Oct. 10, 2011
Applicants:

Lee Han Meng Eugene Lee, Muar, MY;

Kok Leong Yeo, Melaka, MY;

Kooi Choon Ooi, Melaka, MY;

Chen Seong Chua, Melaka, MY;

Inventors:

Lee Han Meng Eugene Lee, Muar, MY;

Kok Leong Yeo, Melaka, MY;

Kooi Choon Ooi, Melaka, MY;

Chen Seong Chua, Melaka, MY;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); B29C 45/14 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14 (2013.01); B29C 45/14655 (2013.01); H01L 2924/18161 (2013.01); H01L 23/4951 (2013.01); H01L 2224/16245 (2013.01); H01L 23/49572 (2013.01); H01L 23/3107 (2013.01); H01L 23/495 (2013.01); H01L 21/78 (2013.01); H01L 24/97 (2013.01); H01L 21/56 (2013.01); H01L 2924/01029 (2013.01); H01L 21/565 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1815 (2013.01);
Abstract

In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object.


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