This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Innovations by Chen Seong Chua
Introduction
Chen Seong Chua is an accomplished inventor based in Malacca, Malaysia. He is known for his innovative contributions to the field of integrated circuit packaging. His work focuses on enhancing the durability and functionality of electronic components.
Latest Patents
One of Chen Seong Chua's notable patents is an exposed die package designed to protect the exposed die from damage. This invention describes an integrated circuit package that features a protective housing extending beyond the exposed back surface of the die. This design helps safeguard the die from potential damage. The integrated circuit package includes a lead frame and an integrated circuit die, which is both electrically and physically attached to the lead frame. The housing encapsulates the lead frame and die, while also incorporating a recessed region at the bottom of the package where the back surface of the die is exposed. Additionally, a protruding protective structure at the bottom of the package prevents the exposed back surface of the die from coming into contact with external objects.
Career Highlights
Chen Seong Chua is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to contribute significantly to advancements in integrated circuit technology.
Collaborations
Chen has collaborated with several talented individuals, including Lee Han Meng, Eugene Lee, and Kok Leong Yeo. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Chen Seong Chua's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patent for an exposed die package reflects his ability to address industry challenges effectively. Through his work at Texas Instruments and collaborations with fellow inventors, he continues to make a significant impact in the technology sector.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
