This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Panasonic Corporation. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Koki Fujiwara: Semiconductor Molding Innovation.
Introduction
Koki Fujiwara is an inventor based in Tokyo, Japan, and is associated with Panasonic Corporation. His patent work addresses resin molding for semiconductor devices.
Latest Patents
Fujiwara is credited with 1 patent: “Resin-sealed mold and resin-sealed device.” The invention describes a mold with opposing upper and lower dies and multiple middle dies positioned between them. The middle dies have molding faces at their tips that face one another during resin sealing. They can open to the right and left along dividing faces, enabling the molding of semiconductor-device resin packages with a concave feature on a side surface.
Career Highlights
Fujiwara’s listed patent reflects work on mold design for semiconductor packaging. The described configuration is intended to accommodate package shapes that may be difficult to produce with a conventional mold arrangement.
Collaborations
Fujiwara’s listed coworkers include Noriaki Koga and Takuro Endo. The available information does not specify their individual roles in the patent.
Conclusion
Koki Fujiwara’s patent documents a mold design that supports resin sealing of semiconductor devices with a concave side feature, highlighting his contribution to semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile