The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Nov. 10, 2005
Noriaki Koga, Kagoshima, JP;
Tadaaki Ikeda, Kagoshima, JP;
Koki Fujiwara, Tokyo, JP;
Takuro Endo, Tokyo, JP;
Noriaki Koga, Kagoshima, JP;
Tadaaki Ikeda, Kagoshima, JP;
Koki Fujiwara, Tokyo, JP;
Takuro Endo, Tokyo, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (), a lower die () disposed so as to be opposed to the upper die (), and a plurality of middle dies () sandwiched between the upper die () and the lower die (), wherein the plurality of middle dies () are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies () can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.