Ibi-gun, Japan

Koji Kuribayashi

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Ibiden Company Limited. Active years: 2012-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Kuribayashi. Retrieved from https://idiyas.com/inventor/koji-kuribayashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2012-2013

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2 patents (USPTO):Explore Patents

Title: Koji Kuribayashi: Innovator in Solder Ball Loading Technology

Introduction

Koji Kuribayashi is a notable inventor based in Ibi-gun, Japan. He has made significant contributions to the field of solder ball loading technology, holding a total of 2 patents. His innovative approaches have enhanced the efficiency and reliability of solder ball loading methods in printed wiring boards.

Latest Patents

One of Kuribayashi's latest patents is a solder ball loading mask, apparatus, and associated methodology. This invention provides a method capable of securely loading solder balls on connection pads. The process involves applying flux on each connection pad group of a printed wiring board while ensuring that flux is not applied to the contact portion between a spacer and the printed wiring board. This design prevents flux from attaching to the spacer, allowing the mask to be detached without inverting the printed wiring board, thereby minimizing damage to the solder resist layer. Additionally, the heights of the solder balls and the upper surface of the mask are made equal using the spacer, which ensures that one solder ball is securely loaded onto each connection pad, reducing the likelihood of multiple solder balls being loaded onto a single connection pad.

Career Highlights

Koji Kuribayashi is currently employed at Ibiden Company Limited, where he continues to develop innovative solutions in his field. His work has been instrumental in advancing solder ball loading techniques, contributing to the overall improvement of electronic manufacturing processes.

Collaborations

Throughout his career, Kuribayashi has collaborated with notable colleagues such as Shigeki Sawa and Katsuhiko Tanno. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Koji Kuribayashi's contributions to solder ball loading technology exemplify his commitment to innovation in the electronics industry. His patents reflect a deep understanding of the challenges in the field and provide effective solutions that enhance manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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