Koji Komemura

Title: **Koji Komemura: Innovator in Circuit Board Technologies**

Introduction

Koji Komemura, an inventive mind based in Nagano, Japan, has made significant contributions to the field of electronic engineering. With a remarkable portfolio of 4 patents under his name, he has pushed the boundaries of circuit board technology and manufacturing methods.

Latest Patents

Komemura's latest patents showcase his innovative approach to circuit board production. One notable patent involves a groundbreaking method for producing a circuit board, which includes adhering a plastic deformable insulating material onto a laminate surface that incorporates a patterned first-metal-layer on a second-metal-layer. This intricate process encompasses curing the material and forming a plate structure before meticulously opening holes and filling them with electroconductive paste. Furthermore, his patent related to a wiring substrate involves a laminated sheet that features a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern, offering advanced capabilities in electrical connectivity.

Career Highlights

Throughout his esteemed career, Koji Komemura has been associated with prestigious companies such as Fujitsu Corporation and Sony Corporation. His tenure at these organizations has allowed him to hone his skills in innovation and technology development, establishing him as a respected figure in the engineering community.

Collaborations

Komemura has collaborated with notable peers in the industry, including Kenji Iida and Takashi Nakagawa. These partnerships have not only enriched his professional journey but also enabled impactful advancements in his field.

Conclusion

In summary, Koji Komemura stands out as a dedicated inventor whose research and developments in circuit board technology continue to influence the electronics industry. With a solid foundation built on partnerships and innovative solutions, his work is poised to leave a lasting legacy in electronic engineering.