Koji Honna

Title: The Innovative Contributions of Koji Honna

Introduction

Koji Honna is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the fabrication processes and performance of semiconductor devices.

Latest Patents

Honna's latest patents include a method of fabricating a semiconductor having a through hole. This semiconductor device comprises a semiconductor chip, a tape for mounting the chip, an adhesive resin layer, and solder balls attached to the tape. The innovative method involves forming at least one hole in the tape after fixing the semiconductor chip, utilizing a TAB tape made of polyimide with high water permeability. Another significant patent is for a resin molded semiconductor device and its manufacturing method. This device includes a semiconductor chip, an FPC tape, and a mold resin that protects the chip. The mold resin is designed to mitigate warpage, with specific properties such as a glass transition temperature not lower than 200°C and a coefficient of linear expansion between 13 to 18 ppm/°C.

Career Highlights

Koji Honna is currently employed at Fujitsu Corporation, where he continues to innovate in semiconductor technology. His work has contributed to advancements in the efficiency and reliability of semiconductor devices, which are crucial in various electronic applications.

Collaborations

Honna has collaborated with notable colleagues such as Fumihiko Taniguchi and Yoshikazu Kumagaya. These collaborations have further enhanced the development of innovative semiconductor solutions.

Conclusion

Koji Honna's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the advancement of electronic devices, showcasing the importance of innovation in technology.