Tokyo, Japan

Koichiro Mukoyama


Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 1988-1997

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2 patents (USPTO):Explore Patents

Title: Koichiro Mukoyama: Innovator in Gold Wire Technology

Introduction

Koichiro Mukoyama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of advanced gold wire bonding solutions. With a total of 2 patents, Mukoyama's innovations are paving the way for improved performance in integrated circuits.

Latest Patents

Mukoyama's latest patents include a gold wire for bonding and a gold line for bonding semiconductor elements. The first patent describes a gold wire designed for IC chip bonding that is resistant to breakage during thermosonic wire bonding. This wire contains specific percentages of platinum, silver, magnesium, and europium, with the balance being high-purity gold. The second patent focuses on a wire bonding gold line that connects semiconductor tip electrodes to outside lead portions. This wire boasts a high purity level of gold and incorporates germanium to reduce electric resistance while maintaining excellent mechanical strength.

Career Highlights

Koichiro Mukoyama is associated with Tanaka Denshi Kogyo Kabushiki Kaisha, a company known for its innovations in electronic materials. His work has significantly impacted the efficiency and reliability of semiconductor manufacturing processes.

Collaborations

Mukoyama collaborates with notable colleagues such as Yasuo Fukui and Hiromi Yamamoto, contributing to a dynamic team focused on advancing technology in their field.

Conclusion

Koichiro Mukoyama's contributions to gold wire technology exemplify the importance of innovation in the semiconductor industry. His patents reflect a commitment to enhancing the performance and reliability of electronic components.

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