The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 1988
Filed:
May. 15, 1986
Applicant:
Inventors:
Assignee:
Tanaka Denshi Kogyo Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420507 ; 428606 ;
Abstract
This invention relates to a wire bonding gold line used for connecting a semiconductor tip electrode with an outside lead portion. This gold wire characteristically contains gold (Au) having a purity level 99.996-99.9995 wt % and 0.0032-0.008 wt % by total weight of said gold wire of germanium (Ge) so that the electric resistance of the wire bonding gold line is reduced, while the mechanical strength such as tensile strength and high temperature strength is excellent and a gold ball can be shaped into the form of a nearly perfect sphere in the connection of the tip electrode.