The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 1997
Filed:
Jan. 17, 1996
Applicant:
Inventors:
Shinichi Hanada, Tokyo, JP;
Koichiro Mukoyama, Tokyo, JP;
Assignee:
Tanaka Denshi Kogyo Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
428364 ; 428606 ; 420507 ; 420510 ; 420511 ;
Abstract
According to the present invention provided is a gold wire for IC chip bonding which wire is unlikely to be broken after thermosonic wire bonding at an increased ultrasonic output, subsequent reverse deformation involving severe bonding and deformation of a ball neck portion and formation of a loop. The bonding gold wire essentially consists of 0.0001-0.005 wt % of Pt, 0.0001-0.005 wt % of Ag, 0.0005-0.005 wt % of Mg and 0.00005-0.005 wt % of Eu; with the balance being Au, said Au having less than 0.001% by weight of incidental impurity.