Shinichi Hanada

Title: The Innovations of Shinichi Hanada

Introduction

Shinichi Hanada is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the area of bonding materials for integrated circuits. His innovative approach has led to the development of a specialized gold wire that enhances the reliability of IC chip bonding.

Latest Patents

Hanada holds a patent for a gold wire designed for IC chip bonding. This gold wire is engineered to withstand the rigors of thermosonic wire bonding, even at increased ultrasonic outputs. The patent details a composition that includes 0.0001-0.005 wt % of platinum (Pt), 0.0001-0.005 wt % of silver (Ag), 0.0005-0.005 wt % of magnesium (Mg), and 0.00005-0.005 wt % of europium (Eu), with the remainder being gold (Au). The gold used in this wire contains less than 0.001% by weight of incidental impurities, ensuring high quality and performance.

Career Highlights

Shinichi Hanada is associated with Tanaka Denshi Kogyo Kabushiki Kaisha, a company known for its advancements in electronic materials and components. His work has been pivotal in improving the durability and effectiveness of bonding processes in semiconductor manufacturing.

Collaborations

Hanada collaborates with Koichiro Mukoyama, another expert in the field, to further enhance the development of innovative materials for electronic applications.

Conclusion

Shinichi Hanada's contributions to the field of semiconductor technology through his patented gold wire for IC chip bonding exemplify the importance of innovation in enhancing electronic manufacturing processes. His work continues to influence the industry positively.