Location History:
- Tokyo, JP (1989 - 2012)
- Chiyoda-ku, JP (2020)
Company Filing History:
1 out of 2,560 
1 out of 1,025 
1 out of 7,968 
Years Active: 1989-2020
Title: Koichi Shibuya: Innovator in Bonding Technologies
Introduction
Koichi Shibuya is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technologies, holding a total of 3 patents. His work focuses on enhancing the reliability and sealing properties of electronic devices.
Latest Patents
Shibuya's latest patents include a composition for bonding that features tin, germanium, and nickel. The composition specifies that the contained amount of germanium is less than or equal to 10 mass percent. Additionally, the amount of nickel is limited to a product of 2.8 multiplied by the contained amount of germanium raised to the power of 0.3. Another notable patent involves a glass member equipped with a sealing material layer, aimed at improving the sealing properties and reliability of electronic devices. This invention addresses issues such as cracks and fractures in glass substrates during laser sealing. The sealing material layer comprises a glass material containing low-expansion filler and a laser absorbent, ensuring optimal bonding of glass substrates.
Career Highlights
Throughout his career, Koichi Shibuya has worked with notable companies such as Asahi Glass Company, Limited and AGC Inc. His experience in these organizations has contributed to his expertise in the field of bonding technologies.
Collaborations
Shibuya has collaborated with several professionals, including Asahi Ide and Sohei Kawanami. These partnerships have further enriched his work and innovations in bonding technologies.
Conclusion
Koichi Shibuya is a distinguished inventor whose work in bonding technologies has led to significant advancements in electronic device reliability. His patents reflect a commitment to innovation and excellence in the field.