The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2012

Filed:

May. 23, 2011
Applicants:

Koichi Shibuya, Tokyo, JP;

Asahi Ide, Tokyo, JP;

Sohei Kawanami, Koriyama, JP;

Inventors:

Koichi Shibuya, Tokyo, JP;

Asahi Ide, Tokyo, JP;

Sohei Kawanami, Koriyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); H05B 33/04 (2006.01); H05B 6/00 (2006.01); H01J 9/26 (2006.01); B29C 65/16 (2006.01); H01L 31/042 (2006.01); H01L 27/142 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention seeks to increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substratehas a sealing region. On the sealing region, a sealing material layercomprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layerand contains low-expansion filler particles having particle sizes within a range of from 0.5T to 1T based on the thickness T of the sealing material layerin a volume ratio of from 0.1 to 50%. Such a glass substrateand a glass substratehaving an element-formed region provided with an electronic element are laminated, and the sealing material layeris irradiated with a laser lightand melted to bond the glass substratesand


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